The automatic wafer packaging machine has a very close connection with the packaging of the food industry, such as packaging of wafer, biscuit, cookies, bread, candy, fruit, vegetable, etc. Of course, different products need different models, and different models with different price.
Automatic Wafer Packaging Machine Features:
〇 The advanced color standard detector makes the color standard detection more accurate.
〇 Multiple sealing methods, you can choose any sealing ways of reticulation, straight grain or vertical grain.
〇 The wafer packaging machine uses advanced microcomputer packaging controller, excellent man-machine dialogue mode, so that speed, bag length, tangential point position detection can be directly displayed on the interface.
〇 The differential feeding mode makes it convenient to adjust the feeding position during the operation of the wafer packaging machine.
〇 Sliding horizontal seal mechanism can adjust the center height of horizontal seal arbitrarily.
Wafer Packaging Process:
1. Manually place the wafer packing material on the feeding device.
2. The film transport device automatically transports the film.
3. When the film passes through the bag forming machine, the former makes the film into a bag.
4. When the shaped bag passes through the longitudinal sealing device, the longitudinal sealing mechanism seals the back of the bag.
5. After sealing the bag and passing through the transverse sealing and cutting device, it starts to be transverse sealed and the packaged finished products are automatically output.
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Technical Data
Model
CK-ZS450X
Film width
Max 450mm
Bag width
50-180mm
Product height
Max 80mm
Film diameter
320mm
packing speed
40-230bags/min
Machine size
4020*820*1450mm
Weight
1050kg
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